Invitation to CUHK Robotics Open Day
cum
HKSTP, Lenovo Group, and HKCLR Collaboration Agreement Signing Ceremony
In celebration of CUHK’s 60th anniversary, the CUHK T Stone Robotics Institute (CURI) is joining hands with Hong Kong Science Park to present the CUHK Robotics Open Day cum HKSTP, Lenovo Group, and HKCLR Collaboration Agreement Signing Ceremony on 27 July 2023.
Since its establishment in 2015, CURI has made significant achievements in the research and development of construction, logistics, and medical robotics, incubated 8 spin-off companies, and contributed to the establishment of 3 InnoCentres. Featuring the best-in-class robotics innovations in CUHK, the Open Day aims to promote the technology transfer and commercialisation of the most state-of-art robotics in Hong Kong, showcase CUHK’s significant contribution and influence in the advancement of robotics and AI development, and educate our next generation for future success.
Apart from the exhibition of the robotics innovations, the Open Day will also be highlighted by the announcement of the co-incubation collaboration between HKSTP, Lenovo Group, and HKCLR, aiming to nurture next-generation innovators and academics on robotics and AI, and to drive transformative breakthroughs to the world.
The event has attracted diverse participation from government officials, business leaders, industry partners, investors, and venture capitalists. It would be a perfect occasion to network, exchange knowledge, and explore collaboration opportunities with world-class research teams and organisations on the ready-to-use robotics innovations that could level up the industry in a way we would never possibly imagine before.
Please find the details of the event below:
